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WD rolls out first 64 layer 3D Nand Technology

Western Digital has successfully developed its next generation 3D NAND technology, BiCS3, with 64 layers of vertical storage capability. Pilot production of the new technology has commenced in the Yokkaichi, Japan joint venture facilities and initial output is expected later this year. Western Digital expects meaningful commercial volumes of BiCS3in the first half of calendar 2017.

“The launch of the next generation 3D NAND technology based on our industry-leading 64 layer architecture reinforcesour leadership in NAND flash technology,” said Dr. Siva Sivaram, executive vice president, memory technology, Western Digital.“BiCS3 will feature the use of 3-bits-per-cell technologyalong with advances in high aspect ratio semiconductor processing to deliver higher capacity, superior performance and reliability at anattractive cost. Together with BiCS2, our 3D NAND portfolio has broadened significantly,enhancing our ability to address a full spectrum of customer applicationsin retail, mobile and datacenter.”

BiCS3, which has been developed jointly with Western Digital’s technology and manufacturing partner Toshiba, will be initially deployed in 256gigabit capacity and will be available in a range of capacities up to half a terabit on a single chip. Western Digital expects volume shipments of BiCS3for the retail market in the fourth calendar quarter of 2016 and to begin OEM sampling this quarter. Shipments of the company’s previous generation 3D NAND technology, BiCS2, continueto customers in retail and OEM.